Specifications (Technical Performance)
| Density: | 200.0 kg/m³ Made from recycled materials, supporting zero‑emission and sustainability goals. Lightweight yet durable |
| Typical Service Temperature: | -40°C to 100°C (approx.) |
FUCB200-11901
Material Type 材料类型: Chip Bonded PU foam
FUCB200-11901 is a functional polyurethane composite material. Made by crushing and blending urethane foams, rubber sponge, and other remnants to create re‑bonded functional materials with cushioning, sealing, and vibration‑damping properties. Typically used in automotive, electronics, housing, and industrial applications where durability and multi‑functionality are required.
FUCB200-11901 是一种功能性聚氨酯复合材料。通过粉碎并混合聚氨酯泡棉、橡胶海绵和其他边角料制成，形成具有缓冲、密封和减振性能的再生粘合功能材料。通常用于需要耐用性和多功能性的汽车、电子、住宅及工业应用。
Specifications (Technical Performance)
规格（技术性能）
| 密度： | 200.0 kg/m³ 由再生材料制成，支持零排放与可持续发展目标, 轻质但耐用 |
| 典型使用温度范围： | 约 –40 °C 至 +100 °C |
- Main Application 主要应用: Noise-Vibration-Harshness 噪音振动和声振粗糙度控制, Sealing & Gasketing 密封件和衬垫, Shock & Impact Protection 冲击和撞击保护
- Process 工艺技术: Die-Cut 模切, Lamination and Coating 贴胶和涂层
- Industry/Segment 行业/细分领域: Aerospace 航空航天, Building & Construction 建筑与施工, Consumer 消费电子, Electrical and Electronics 电气与电子, Healthcare & Medical 医疗保健与器械, Industrial 工业设备, Mobility 移动出行